■Applicable objects:

　　IC, LSI resin package
　　Crystal (transistor) tube, diode and other single semiconductor resin package
　　QFN type resin package
　　Use high-pressure water to remove flashes, burrs and foreign objects that occur during the resin molding process on the above products
■Features:

　　Single channel loading system
　　 Conveying speed 10~120mm/s
　　 Diamond nozzle
　　The fixture for fixing the lead frame is roller type
　　 takes up less space